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Inventor

BRIAN E. GOODLIN

Inventor
US

Overview

2→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
H10DInorganic electric semiconductor devices14%
PatentTitleYear
11,616,011IC having trench-based metal-insulator-metal capacitor202311,498,831Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to TEXAS INSTRUMENTS INC (2)· patent assignee history
2022–2023Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TEXAS INSTRUMENTS INC22022–2023
Locations
LocationPatentsSpan
US22022–2023