LexDanaLexDanabeta
Inventor

Tat Chi Chan

Inventor
Hong Kong, CN

Overview

4→
Patents
2010–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
C22CAlloys10%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes10%
H01LSemiconductor devices10%
H04LTransmission of digital information, e.g. telegraphic communication10%
H04MTelephonic communication10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
PatentTitleYear
10,979,305Web interface usage tracker202110,475,666Routable electroforming substrate comprising removable carrier20198,012,886'Leadframe treatment for enhancing adhesion of encapsulant thereto'20117,691,679'Pre-plated leadframe having enhanced encapsulation adhesion'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2011Patents assigned to ASM ASSEMBLY MATERIALS LTD (2)· patent assignee history
2010–2019Based in Hong Kong, CN· patent location history
2019Patents assigned to ASM TECH SINGAPORE PTE LTD (1)· patent assignee history
2021Patents assigned to WELLS FARGO BANK NA (1)· patent assignee history
2021Based in San Francisco, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASM ASSEMBLY MATERIALS LTD22010–2011
ASM TECH SINGAPORE PTE LTD12019
WELLS FARGO BANK NA12021
Locations
LocationPatentsSpan
Hong Kong, CN32010–2019
San Francisco, California, US12021