Inventor
Tzeun-luh Huang
Inventor
Portland, OR, US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
C23FNon-mechanical removal of metallic material from surface22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
C22CAlloys11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
7,087,996'Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead'20066,749,760'Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead'20046,740,427'Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2006Patents assigned to INTEL CORP (3)· patent assignee history
2004–2006Based in Portland, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 3 | 2004–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Portland, OR, US | 3 | 2004–2006 |