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Inventor

Lap Kei Chow

Inventor
Hong Kong, CN

Overview

2→
Patents
2006–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
G01BMeasuring length, thickness or similar linear dimensions14%
G01NInvestigating or analysing materials by determining their chemical or physical properties14%
H01LSemiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
11,011,435Apparatus and method inspecting bonded semiconductor dice20216,982,491'Sensor semiconductor package and method of manufacturing the same'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006Patents assigned to ASAT LTD (1)· patent assignee history
2006Based in Kowloon, HK· patent location history
2021Patents assigned to ASM TECH SINGAPORE PTE LTD (1)· patent assignee history
2021Based in Hong Kong, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASAT LTD12006
ASM TECH SINGAPORE PTE LTD12021
Locations
LocationPatentsSpan
Hong Kong, CN12021
Kowloon, HK12006