Inventor
ALBERT WAN
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01QAntennas, i.e. radio aerials19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
G06VImage or video recognition or understanding12%
PatentTitleYear
12,266,847Semiconductor packages and manufacturing methods thereof202512,057,415Semiconductor device having antenna and manufacturing method thereof202411,855,333Semiconductor packages and manufacturing methods thereof202311,705,409Semiconductor device having antenna on chip package and manufacturing method thereof202311,515,618Semiconductor packages and manufacturing methods thereof202211,335,655Package structure and manufacturing method thereof202211,282,810Integrated fan-out package and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2025 |