Inventor
Yuki Ori
Inventor
Ibaraki, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form21%
C25DProcesses for the electrolytic or electrophoretic production of coatings21%
H05KPrinted circuits21%
Y10TTechnical subjects covered by former us classification21%
C23CCoating metallic material7%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution7%
PatentTitleYear
10,925,170Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device202110,925,171Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device202110,791,631Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device2020Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2020–2021Patents assigned to JX NIPPON MINING & METALS CORP (3)· patent assignee history
2020–2021Based in Ibaraki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JX NIPPON MINING & METALS CORP | 3 | 2020–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 3 | 2020–2021 |