Inventor

MingXian Sun

Inventor

Shenzhen, CN

Overview

2006–2021

Patent span

Mechanical engineering

Primary field (CPC F)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact20%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application20%

G06FElectric digital data processing20%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2006Patents assigned to HON HAI PREC IND CO LTD (1)· patent assignee history

2006–2007Based in Shenzhen, CN· patent location history

2007Patents assigned to FOXCONN TECH CO LTD (1)· patent assignee history

2021Patents assigned to Baidu online network technology beijing co ltd (1)· patent assignee history

2021Based in Beijing, CN· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
Baidu online network technology beijing co ltd	1	2021
FOXCONN TECH CO LTD	1	2007
HON HAI PREC IND CO LTD	1	2006

Locations

Location	Patents	Span
Shenzhen, CN	2	2006–2007
Beijing, CN	1	2021