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Inventor

William A. Stanton

Inventor
Boise, ID, US

Overview

72→
Patents
1984–2014
Patent span
Physics
Primary field (CPC G)

Patents· 72 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices55%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H10BElectronic memory devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
H10DInorganic electric semiconductor devices3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them2%
G06FElectric digital data processing2%
G11CStatic stores2%
PatentTitleYear
8,859,168'Masks for microlithography and methods of making and using such masks'20148,785,989'Semiconductor constructions'20148,595,655'Method and system for lithographic simulation and verification'20138,589,826'Photomask constructions having liners of specified compositions along sidewalls of multi-layered structures'20138,584,058'Methods for defining evaluation points for optical proximity correction and optical proximity correction methods including same'20138,547,526'Photolithography systems and associated methods of selective die exposure'20138,365,101'Photomask constructions having liners of specified compositions along sidewalls of multi-layered structures'20138,263,962'Inverted variable resistance memory cell and method of making the same'20128,037,446'Methods for defining evaluation points for optical proximity correction and optical proximity correction methods including same'20117,972,753'Masks for microlithography and methods of making and using such masks'20117,964,503'Methods of patterning photoresist, and methods of forming semiconductor constructions'20117,932,003'Methods of forming and using reticles'20117,930,657'Methods of forming photomasks'20117,858,921'Guided-mode-resonance transmission color filters for color generation in CMOS image sensors'20107,838,178'Masks for microlithography and methods of making and using such masks'20107,818,710'Method and system for lithographic simulation and verification'20107,760,329'Optimized optical lithography illumination source for use during the manufacture of a semiconductor device'20107,754,395'Methods of forming and using reticles'20107,718,533'Inverted variable resistance memory cell and method of making the same'20107,432,197'Methods of patterning photoresist, and methods of forming semiconductor constructions'20087,401,010'Methods of forming radiation-patterning tools; carrier waves and computer readable media'20087,350,182'Methods of forming patterned reticles'20087,282,666'Method and apparatus to increase throughput of processing using pulsed radiation sources'20077,283,205'Optimized optical lithography illumination source for use during the manufacture of a semiconductor device'20077,276,315'Methods for generating or designing sidelobe inhibitors for radiation patterning tools'20077,273,684'Mask having transmissive elements and a common sidelobe inhibitor for sidelobe suppression in radiated patterning'20077,229,724'Reticles and methods of forming and using the same'20077,226,707'Methods of printing structures'20077,130,022'Methods and systems for controlling radiation beam characteristics for microlithographic processing'20067,107,572'Methods of forming patterned reticles'20067,105,278'Pattern mask with features to minimize the effect of aberrations'20067,093,227'Methods of forming patterned reticles'20067,086,031'Methods of forming patterned reticles'20067,073,161'Methods of forming patterned reticles'20067,046,339'Optimized optical lithography illumination source for use during the manufacture of a semiconductor device'20067,008,738'Microlithographic structures and method of fabrication'20066,911,301'Methods of forming aligned structures with radiation-sensitive material'20056,894,765'Methods and systems for controlling radiation beam characteristics for microlithographic processing'20056,887,629'Radiation-patterning tool'20056,854,106'Reticles and methods of forming and using the same'20056,844,118'Method and layout for high density reticle'20056,842,889'Methods of forming patterned reticles'20056,818,910'Writing methodology to reduce write time, and system for performing same'20046,818,359'Reticles and methods of forming and using the same'20046,807,519'Methods of forming radiation-patterning tools; carrier waves and computer readable media'20046,803,157'Pattern mask with features to minimize the effect of aberrations'20046,803,155'Microlithographic device, microlithographic assist features, system for forming contacts and other structures, and method of determining mask patterns'20046,753,617'Method for improving a stepper signal in a planarized surface over alignment topography'20046,746,824'Reticle design for alternating phase shift mask'20046,737,200'Method for aligning a contact or a line to adjacent phase-shifter on a mask'20046,524,751'Reticle design for alternating phase shift mask'20036,501,188'Method for improving a stepper signal in a planarized surface over alignment topography'20026,465,138'Method for designing and making photolithographic reticle, reticle, and photolithographic process'20026,447,961'Optical proximity correction methods, and methods forming radiation-patterning tools'20026,418,008'Enhanced capacitor shape'20026,413,684'Method to eliminate side lobe printing of attenuated phase shift masks'20026,401,236'Method to eliminate side lobe printing of attenuated phase shift'20026,391,709'Enhanced capacitor shape'20026,376,130'Chromeless alternating reticle for producing semiconductor device features'20026,372,639'Method for constructing interconnects for sub-micron semiconductor devices and the resulting semiconductor devices'20026,369,432'Enhanced capacitor shape'20026,319,644'Methods of reducing proximity effects in lithographic processes'20016,284,419'Methods of reducing proximity effects in lithographic processes'20016,258,489'Mask design utilizing dummy features'20016,245,468'Optical proximity correction methods, and methods of forming radiation-patterning tools'20016,242,816'Method for improving a stepper signal in a planarized surface over alignment topography'20016,238,824'Method for designing and making photolithographic reticle, reticle, and photolithographic process'20016,214,497'Method to eliminate side lobe printing of attenuated phase shift masks'20016,144,109'Method for improving a stepper signal in a planarized surface over alignment topography'20006,120,952'Methods of reducing proximity effects in lithographic processes'20005,932,491'Reduction of contact size utilizing formation of spacer material over resist pattern'19994,425,080'Gas turbine engine casing'1984

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1984Based in Thorneywood, GB· patent location history
1999–2014Patents assigned to MICRON TECHNOLOGY INC (69)· patent assignee history
1999Based in Boixe, ID, US· patent location history
2000–2014Based in Boise, ID, US· patent location history
2010Patents assigned to APTINA IMAGING CORP (1)· patent assignee history
2011–2013Based in Hillsboro, OR, US· patent location history
2013–2014Patents assigned to STANTON WILLIAM A (4)· patent assignee history
2013Patents assigned to WANG FEI (2)· patent assignee history
2013Based in Beaverton, OR, US· patent location history
2014Patents assigned to BISSEY LUCIEN J (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC691999–2014
STANTON WILLIAM Aself42013–2014
WANG FEI22013
APTINA IMAGING CORP12010
BISSEY LUCIEN J12014
Locations
LocationPatentsSpan
Boise, ID, US672000–2014
Hillsboro, OR, US22011–2013
Beaverton, OR, US12013
Boixe, ID, US11999
Thorneywood, GB11984