Inventor
DYI-CHUNG HU
Inventor
TW
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01LSemiconductor devices34%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
G01RMeasuring electric variables8%
B23KSoldering or unsoldering2%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C03CChemical composition of glasses, glazes or vitreous enamels2%
H01QAntennas, i.e. radio aerials2%
H05KPrinted circuits2%
PatentTitleYear
12,550,758Substrate and manufacturing method thereof202612,315,788Semiconductor substrate and manufacturing method thereof202512,249,567Manufacturing method of integrated substrate structure202512,210,053Semiconductor device202512,199,027Substrate and manufacturing method thereof202512,198,993Manufacturing method of circuit carrier with chip mounted thereon202512,176,277Package substrate and package structure202412,148,726Semiconductor substrate structure, semiconductor structure and manufacturing method thereof202412,148,688Semiconductor substrate and manufacturing method thereof202412,100,632Glass core substrate and manufacturing method thereof202412,014,934Semiconductor substrate structure and manufacturing method thereof202412,009,329Manufacturing method of integrated substrate202411,984,403Integrated substrate structure, redistribution structure, and manufacturing method thereof202411,948,899Semiconductor substrate structure and manufacturing method thereof202411,876,291Millimeter-wave antenna module package structure and manufacturing method thereof202411,862,545Integrated substrate structure, electronic assembly, and manufacturing method thereof202411,791,256Package substrate and method of fabricating the same202311,567,122Semiconductor device and manufacturing method thereof202311,404,335Manufacturing method of carrier for semiconductor chip mounting thereon202211,309,252Package substrate and package structure2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to HU DYI CHUNG (19)· patent assignee history
2022–2026Based in TW· patent location history
2023Patents assigned to IND TECH RES INST (1)· patent assignee history
2023Patents assigned to UNIMICRON TECHNOLOGY CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HU DYI CHUNGself | 19 | 2022–2026 |
| IND TECH RES INST | 1 | 2023 |
| UNIMICRON TECHNOLOGY CORP | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 20 | 2022–2026 |