Inventor
Anton Huber
Inventor
Burghausen, DE
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
B24BMachines, devices, or processes for grinding or polishing10%
B28DWorking stone or stone-like materials9%
B23DPlaning6%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for4%
B29CShaping or joining of plastics3%
G06FElectric digital data processing3%
H03KPulse technique3%
H05KPrinted circuits3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,959,339Manufacturing a product using a soldering process202110,692,403Modular security control device202010,245,661Wire guide roll for wire saw and method20199,073,135'Method for slicing wafers from a workpiece'20158,968,054'Method for cooling a workpiece made of semiconductor material during wire sawing'20158,746,227'Method for slicing wafers from a workpiece'20148,589,775'Error tolerant flip-flops'20138,502,585'Device with a data retention mode and a data processing mode'20138,276,508'Overload protection, drive train comprising such an overload protection, device comprising a lifting tool, and method for applying working forces'20127,816,198'Semiconductor device and method for manufacturing the same'20107,766,724'Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers'20107,767,470'Semiconductor wafers with highly precise edge profile and method for producing them'20107,704,126'Method for producing a semiconductor wafer with profiled edge'20107,690,883'Pivoting basket stacker for deep-drawn articles'20107,108,583'Method for removing material from a semiconductor wafer'20067,077,726'Semiconductor wafer with improved local flatness, and method for its production'20066,861,360'Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers'20056,421,414'Detector for large wafer surfaces'20026,390,896'Method and device for cutting a multiplicity of disks from a hard brittle workpiece'20026,117,776'Wafer holder and method of producing a semiconductor wafer'20005,691,964'Music playing system with decentralized units'19975,567,199'Workpiece holder for rotary grinding machines for grinding semiconductor wafers, and method of positioning the workpiece holder'19965,565,613'2-arylpropionic acid preparations and process for their production'19965,416,360'Circuit configuration for the passenger protection device of a vehicle'19955,400,548'Process for manufacturing semiconductor wafers having deformation ground in a defined way'19955,327,014'Firing control device for triggering a passenger restraint system of a vehicle'19945,170,066'Single-sensing airbag system with zero power consumption in the \"key-off\" s t'19924,963,302'Method and apparatus for quality control of molded articles manufactured by injection molding machines or die casting machines'19904,927,382'Electrical function group for a vehicle'19904,595,966'For the protection of an MOS-transistor from overloading'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2020Patents assigned to SIEMENS AG (5)· patent assignee history
1990–1995Based in Regensburg, DE· patent location history
1995–2015Based in Burghausen, DE· patent location history
2005–2019Patents assigned to SILTRONIC AG (10)· patent assignee history
2010–2013Patents assigned to INFINEON TECHNOLOGIES AG (3)· patent assignee history
2010–2013Based in Taufkirchen, DE· patent location history
2010–2012Based in Eugendorf, AT· patent location history
2012–2019Patents assigned to HUBER ANTON (7)· patent assignee history
2014–2019Patents assigned to WIESNER PETER (4)· patent assignee history
2021Based in Boeblingen, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILTRONIC AG | 10 | 2005–2019 |
| HUBER ANTONself | 7 | 2012–2019 |
| SIEMENS AG | 5 | 1986–2020 |
| WIESNER PETER | 4 | 2014–2019 |
| INFINEON TECHNOLOGIES AG | 3 | 2010–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Burghausen, DE | 13 | 1995–2015 |
| Taufkirchen, DE | 3 | 2010–2013 |
| Regensburg, DE | 3 | 1990–1995 |
| Eugendorf, AT | 2 | 2010–2012 |
| Boeblingen, DE | 1 | 2021 |