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Inventor

Daniel CORLISS

Inventor
US

Overview

3→
Patents
2021–2022
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices25%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
G06FElectric digital data processing8%
H10DInorganic electric semiconductor devices8%
H10NElectric solid-state devices not otherwise provided for8%
PatentTitleYear
11,462,512Three-dimensional microelectronic package with embedded cooling channels202211,288,429Electrical mask validation202211,177,130Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to IBM (3)· patent assignee history
2021–2022Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM32021–2022
Locations
LocationPatentsSpan
US32021–2022