Inventor
Constance L. Gettinger
Inventor
Chandler, AZ, US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
B82BNanostructures formed by manipulation of individual atoms, molecules, or limited collections of atoms or molecules as discrete units14%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%
C09KMaterials for miscellaneous applications, not provided for elsewhere14%
H01QAntennas, i.e. radio aerials14%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
7,332,797'Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold'20087,141,454'Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold'20066,562,448'Low density dielectric having low microwave loss'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Patents assigned to 3M INNOVATIVE PROPERTIES CO (1)· patent assignee history
2003Based in Minneapolis, MN, US· patent location history
2006–2008Patents assigned to INTEL CORP (2)· patent assignee history
2006–2008Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 2 | 2006–2008 |
| 3M INNOVATIVE PROPERTIES CO | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 2 | 2006–2008 |
| Minneapolis, Minnesota, US | 1 | 2003 |