Inventor
YOUNG DO KWEON
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
12,165,986Semiconductor package using cavity substrate and manufacturing methods202412,051,611Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby202411,410,935Semiconductor package using cavity substrate and manufacturing methods202211,217,556Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (3)· patent assignee history
2022Patents assigned to MICRON TECHNOLOGY INC (1)· patent assignee history
2022–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 3 | 2022–2024 |
| MICRON TECHNOLOGY INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2022–2024 |