Inventor
Hideaki Oka
Inventor
Minowa, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B25Jprimary
B25JManipulators10%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure10%
C08LCompositions of macromolecular compounds8%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy8%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients7%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
11,114,657Negative electrode for metal secondary battery, metal secondary battery, and method of producing metal secondary battery202111,060,890Sensor and robot202110,950,860Graphite material for negative electrode of lithium ion secondary cell and method for producing the same202110,873,087Metal negative electrode secondary battery and method of manufacturing same202010,826,066Lithium-ion secondary battery202010,594,003Battery system20209,873,201Force detection device, robot, and moving object20189,463,709'Vehicle'20169,381,647'Force detection device, robot, and moving object'20169,217,680'Sensor device, sensor module, robot and method of manufacturing sensor device'20159,091,607'Sensor element, force detecting device, and robot'20159,046,432'Sensor device, sensor module, force sensing apparatus, and robot'20157,666,795'Method for manufacturing semiconductor device'20107,495,287'Semiconductor device and manufacturing method thereof'20097,009,029'Polyamide composition'20066,846,868'Polyamide composition'20056,818,731'Polyamide resin composition'20046,414,064'Polyamide resin composition'20026,403,497'Method of manufacturing semiconductor device by two stage heating of deposited noncrystalline semiconductor'20026,258,927'Polyamide composition'20016,235,563'Semiconductor device and method of manufacturing the same'20016,156,869'Method for producing polyamides'20005,670,608'Polyamide and polyamide composition'19974,069,261'Process for the production of polyhydric alcohols'19783,947,504'Separation and recovery of 3-methyl-3-butene-1-ol'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976–2006Patents assigned to KURARAY CO (9)· patent assignee history
2001–2021Patents assigned to SEIKO EPSON CORP (10)· patent assignee history
2001–2009Based in Suwa, JP· patent location history
2001–2005Based in Tsukuba, JP· patent location history
2004Patents assigned to ASAHI DENKA CO LTD (1)· patent assignee history
2010–2021Based in Minowa, JP· patent location history
2016–2021Patents assigned to TOYOTA MOTOR CO LTD (6)· patent assignee history
2016–2021Based in Nagakute-shi, JP· patent location history
2020–2021Based in Nisshin, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEIKO EPSON CORP | 10 | 2001–2021 |
| KURARAY CO | 9 | 1976–2006 |
| TOYOTA MOTOR CO LTD | 6 | 2016–2021 |
| ASAHI DENKA CO LTD | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Minowa, JP | 5 | 2010–2021 |
| Nisshin, JP | 4 | 2020–2021 |
| Suwa, JP | 3 | 2001–2009 |
| Tsukuba, JP | 3 | 2001–2005 |
| Nagakute-shi, JP | 2 | 2016–2021 |