Inventor
Carlo Waldfried
Inventor
Falls Church, VA, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
C23CCoating metallic material10%
H01JElectric discharge tubes or discharge lamps10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
C01BNon-metallic elements7%
H01LSemiconductor devices5%
Y10TTechnical subjects covered by former us classification3%
B08BCleaning in general2%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
PatentTitleYear
10,882,774Coatings for glass-shaping molds and molds comprising the same202110,770,330Wafer contact surface protrusion profile with improved particle performance202010,497,598Electrostatic chuck and method of making same20199,128,382'Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process'20158,580,076'Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith'20138,338,315'Processes for curing silicon based low-k dielectric materials'20127,709,814'Apparatus and process for treating dielectric materials'20107,704,872'Ultraviolet assisted pore sealing of porous low k dielectric films'20107,678,682'Ultraviolet assisted pore sealing of porous low k dielectric films'20107,629,272'Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics'20097,078,161'Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication'20067,011,868'Fluorine-free plasma curing process for porous low-k materials'20066,951,823'Plasma ashing process'20056,913,796'Plasma curing process for porous low-k materials'20056,834,656'Plasma process for removing polymer and residues from substrates'20046,759,098'Plasma curing of MSQ-based porous low-k film materials'20046,756,085'Ultraviolet curing processes for advanced low-k materials'20046,630,406'Plasma ashing process'20036,558,755'Plasma curing process for porous silica thin film'20036,548,416'Plasma ashing process'20036,184,523'High resolution charged particle-energy detecting, multiple sequential stage, compact, small diameter, retractable cylindrical mirror analyzer system, and method of use'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001Based in Arlington, VA, US· patent location history
2003–2012Patents assigned to AXCELIS TECH INC (10)· patent assignee history
2003–2005Patents assigned to DOW CORNING (2)· patent assignee history
2003–2013Based in Falls Church, VA, US· patent location history
2012–2013Patents assigned to WALDFRIED CARLO (2)· patent assignee history
2012–2021Based in Middleton, MA, US· patent location history
2013–2015Patents assigned to LAM RES CORP (2)· patent assignee history
2019–2021Patents assigned to ENTEGRIS INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AXCELIS TECH INC | 10 | 2003–2012 |
| ENTEGRIS INC | 3 | 2019–2021 |
| DOW CORNING | 2 | 2003–2005 |
| LAM RES CORP | 2 | 2013–2015 |
| WALDFRIED CARLOself | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Falls Church, Virginia, US | 15 | 2003–2013 |
| Middleton, Massachusetts, US | 5 | 2012–2021 |
| Arlington, Virginia, US | 1 | 2001 |