LexDanaLexDanabeta
Inventor

Fujio Ito

Inventor
Hanno, JP

Overview

39→
Patents
2001–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 39 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1057%
H01LSemiconductor devices10%
H05KPrinted circuits7%
H04NPictorial communication, e.g. television5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y10TTechnical subjects covered by former us classification3%
A46BBrushes2%
A61CDentistry2%
B29CShaping or joining of plastics2%
PatentTitleYear
9,978,675Package, electronic component, and electronic apparatus20189,585,287'Electronic component, electronic apparatus, and method for manufacturing the electronic component'20179,253,922'Electronic component and electronic apparatus'20169,220,172'Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus'20159,171,874'Solid-state imaging device including an imaging element and a cover member having a quartz plate'20159,155,212'Electronic component, mounting member, electronic apparatus, and their manufacturing methods'20158,792,031'Solid-state image pickup device and camera'20147,998,795'Method of manufacturing a semiconductor device including plural semiconductor chips'20117,989,267'Manufacturing method of semiconductor device and manufacturing method of lead frame'20117,772,044'Method of manufacturing a semiconductor device including plural semiconductor chips'20107,758,317'Method of analyzing vaporization pattern of solvent and solvent vacuum vaporization device'20107,678,706'Method of manufacturing a semiconductor device'20107,507,606'Semiconductor device and method of manufacturing the same'20097,482,699'Semiconductor device'20097,466,024'Multi-chip semiconductor device package'20087,413,930'Lead frame and method of manufacturing the lead frame'20087,374,973'Manufacturing method of semiconductor device and manufacturing method of lead frame'20087,339,259'Semiconductor device'20087,335,529'Manufacturing method of a semiconductor device utilizing a flexible adhesive tape'20087,247,576'Method of manufacturing a semiconductor device'20077,208,817'Semiconductor device'20077,199,469'Semiconductor device having stacked semiconductor chips sealed with a resin seal member'20077,176,487'Semiconductor integrated circuit'20077,160,759'Semiconductor device and method of manufacturing the same'20077,019,388'Semiconductor device'20066,989,334'Manufacturing method of a semiconductor device'20066,943,456'Plastic molded type semiconductor device and fabrication process thereof'20056,893,898'Semiconductor device and a method of manufacturing the same'20056,809,405'Semiconductor device and method of manufacturing the same'20046,803,258'Semiconductor device'20046,791,182'Semiconductor device'20046,780,679'Semiconductor device and method of manufacturing the same'20046,767,209'Interdental brush and production method therefor'20046,692,989'Plastic molded type semiconductor device and fabrication process thereof'20046,673,655'Method of making semiconductor device having improved heat radiation plate arrangement'20046,558,980'Plastic molded type semiconductor device and fabrication process thereof'20036,456,321'Surveillance camera apparatus, remote surveillance apparatus and remote surveillance system having the surveillance camera apparatus and the remote surveillance apparatus'20026,396,142'Semiconductor device'20026,291,273'Plastic molded type semiconductor device and fabrication process thereof'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2010Patents assigned to HITACHI ULSI SYS CO LTD (13)· patent assignee history
2001–2005Patents assigned to HITACHI LTD (4)· patent assignee history
2001–2011Based in Hanno, JP· patent location history
2002–2007Patents assigned to HITACHI HOKKAI SEMICONDUCTOR (4)· patent assignee history
2002–2018Based in Yokohama, JP· patent location history
2004–2010Patents assigned to RENESAS TECH CORP (16)· patent assignee history
2004Based in Takahama, JP· patent location history
2007–2008Based in Hnno, JP· patent location history
2010Based in Tokyo, JP· patent location history
2014–2018Patents assigned to CANON KK (7)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS TECH CORP162004–2010
HITACHI ULSI SYS CO LTD132001–2010
CANON KK72014–2018
HITACHI HOKKAI SEMICONDUCTOR42002–2007
HITACHI LTD42001–2005
Locations
LocationPatentsSpan
Hanno, JP262001–2011
Yokohama, JP82002–2018
Hnno, JP22007–2008
Tokyo, JP12010
Takahama, JP12004