Inventor
Heng Wan Hong
Inventor
Singapore, SG
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
8,703,544'Electronic component employing a layered frame'20148,125,060'Electronic component with layered frame'2012RE041510'Lead frame'20107,193,298'Lead frame'20076,841,857'Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2014Patents assigned to INFINEON TECHNOLOGIES AG (5)· patent assignee history
2005–2014Based in Singapore, SG· patent location history
2012–2014Patents assigned to HONG HENG WAN (2)· patent assignee history
2012–2014Patents assigned to LI WU HU (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 5 | 2005–2014 |
| HONG HENG WANself | 2 | 2012–2014 |
| LI WU HU | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 5 | 2005–2014 |