Inventor
Chun-Hung Peng
Inventor
Hsinchu, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10BElectronic memory devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests20%
H10DInorganic electric semiconductor devices10%
PatentTitleYear
6,518,148'Method for protecting STI structures with low etching rate liners'20036,187,668'Method of forming self-aligned unlanded via holes'20016,080,674'Method for forming via holes'20006,004,851'Method for manufacturing MOS device with adjustable source/drain extensions'19995,986,310'Prolonging a polysilicon layer in smaller memory cells to prevent polysilicon load punch through'19995,977,598'High load resistance implemented in a separate polysilicon layer with diffusion barrier therein for preventing load punch through therefrom'19995,910,452'Method for reducing antenna effect during plasma etching procedure for semiconductor device fabrication'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999Patents assigned to WINBOND ELECTRONICS CORP (3)· patent assignee history
1999Patents assigned to HOLTEK MICROELECTRONICS INC (1)· patent assignee history
1999–2003Based in Hsinchu, TW· patent location history
2000–2001Patents assigned to UNITED MICROELECTRONICS CORP (2)· patent assignee history
2003Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 3 | 1999 |
| UNITED MICROELECTRONICS CORP | 2 | 2000–2001 |
| HOLTEK MICROELECTRONICS INC | 1 | 1999 |
| TAIWAN SEMICONDUCTOR MFG | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 7 | 1999–2003 |