Inventor
CHIA-CHUN MIAO
Inventor
TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices44%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H04NPictorial communication, e.g. television11%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%
PatentTitleYear
12,218,035Barrier structures between external electrical connectors202511,894,330Methods of manufacturing a semiconductor device including a joint adjacent to a post202411,296,012Barrier structures between external electrical connectors202211,195,864Flip-chip sample imaging devices with self-aligning lid2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to OMNIVISION TECH INC (1)· patent assignee history
2021Based in US· patent location history
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 3 | 2022–2025 |
| OMNIVISION TECH INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 3 | 2022–2025 |
| US | 1 | 2021 |