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Inventor

Tadashi Mitsui

Inventor
Kamakura, JP

Overview

46→
Patents
1982–2021
Patent span
Physics
Primary field (CPC G)

Patents· 46 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Tprimary
G06TImage data processing or generation, in general17%
G06VImage or video recognition or understanding15%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
B82YSpecific uses or applications of nanostructures6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H01FMagnets6%
H01JElectric discharge tubes or discharge lamps5%
G01BMeasuring length, thickness or similar linear dimensions4%
G01QScanning-probe techniques or apparatus4%
B82BNanostructures formed by manipulation of individual atoms, molecules, or limited collections of atoms or molecules as discrete units2%
PatentTitleYear
11,124,843Method and kit for detecting bacteria of genus nitrobacter202110,888,019Electronic device20219,153,419'Pattern defect inspection using data based on secondary electron from pattern'20158,532,395'Pattern inspection method and semiconductor device manufacturing method'20138,355,560'Pattern evaluation system, pattern evaluation method and semiconductor device manufacturing method'20138,290,242'Defect inspection apparatus and defect inspection method'20128,160,349'Pattern shape evaluation method, program, and semiconductor device manufacturing method'20128,150,177'Image processing apparatus, image processing method, defect detection method, semiconductor device manufacturing method, and program'20128,144,969'Pattern evaluation method, computer-readable recording medium, and manufacturing method of semiconductor device'20128,144,338'Pattern measurement apparatus and pattern measurement method'20128,126,257'Alignment of semiconductor wafer patterns by corresponding edge groups'20128,090,192'Pattern misalignment measurement method, program, and semiconductor device manufacturing method'20128,086,041'Pattern evaluation method, pattern matching method and computer readable medium'20118,045,807'Pattern edge detecting method and pattern evaluating method'20118,041,105'Pattern evaluation method, computer-readable medium, and semiconductor device manufacturing method'20118,036,445'Pattern matching method, program and semiconductor device manufacturing method'20118,019,149'Pattern shape evaluation method and pattern shape evaluation apparatus utilizing the same'20118,019,165'Image processing apparatus, image processing method, defect detection method, semiconductor device manufacturing method, and program'20117,879,309'Method for preparing functional nanomaterials utilizing endothermic reaction'20117,787,687'Pattern shape evaluation apparatus, pattern shape evaluation method, method of manufacturing semiconductor device, and program'20107,771,697'Method for preparing functional nanomaterials utilizing endothermic reaction'20107,754,114'Methods for manufacturing optical fiber probe and for processing micromaterial'20107,702,157'Pattern evaluation method, pattern matching method and computer readable medium'20107,668,373'Pattern evaluation method, method of manufacturing semiconductor, program and pattern evaluation apparatus'20107,526,408'Measurement system and method and computer program for processing measurement data'20097,341,681'Method of manufacturing optical fiber probe and for finishing micro material'20087,274,820'Pattern evaluation system, pattern evaluation method and program'20077,151,855'Pattern measurement method, manufacturing method of semiconductor device, pattern measurement apparatus, and program'20066,985,626'Pattern evaluation method, pattern evaluation system and computer-readable recorded medium'20066,769,963'IC handler and contact cleaning method'20046,278,114'Method and apparatus for measuring dimensions of a feature of a specimen'20015,917,205'Photolithographic alignment marks based on circuit pattern feature'19995,702,567'Plurality of photolithographic alignment marks with shape, size and spacing based on circuit pattern features'19975,691,540'Assembly for measuring a trench depth parameter of a workpiece'1997D0385848'Bobbin and magnetic core assembly'19975,611,942'Method for producing tips for atomic force microscopes'19975,491,339'Charged particle detection device and charged particle radiation apparatus'1996D0334913'Bobbin for use with a magnetic core'19935,049,029'Handling apparatus for transferring a semiconductor wafer or LCD'19914,939,494'Surface-mounted-type inductance element'19904,760,366'Ferrite core'19884,549,158'Inductance element'1985D0280810'Ferrite core'19854,424,504'Ferrite core'19844,352,080'Ferrite core'1982D0264959'Transformer core member'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–1984Patents assigned to TDK ELECTRONICS CO LTD (3)· patent assignee history
1982–2021Based in Tokyo, JP· patent location history
1985–1997Patents assigned to TDK CORP (6)· patent assignee history
1996–2015Patents assigned to TOSHIBA KK (28)· patent assignee history
1996–1999Based in Wappingers Falls, NY, US· patent location history
2006–2015Based in Kamakura, JP· patent location history
2006–2009Based in Kanagawa, JP· patent location history
2010–2011Patents assigned to JAPAN SCIENCE & TECH AGENCY (2)· patent assignee history
2010–2011Based in Ibaraki, JP· patent location history
2011–2015Patents assigned to MITSUI TADASHI (11)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK281996–2015
MITSUI TADASHIself112011–2015
TDK CORP61985–1997
TDK ELECTRONICS CO LTD31982–1984
JAPAN SCIENCE & TECH AGENCY22010–2011
Locations
LocationPatentsSpan
Kamakura, JP202006–2015
Tokyo, JP111982–2021
Wappingers Falls, New York, US51996–1999
Kanagawa, JP32006–2009
Ibaraki, JP22010–2011