Inventor
Mikichi Ban
Inventor
Miura, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
G01BMeasuring length, thickness or similar linear dimensions10%
G02BOptical elements, systems or apparatus10%
B08BCleaning in general5%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
Y10TTechnical subjects covered by former us classification5%
C03CChemical composition of glasses, glazes or vitreous enamels2%
G05BControl or regulating systems in general2%
PatentTitleYear
6,776,691'Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus'20046,629,882'Precise polishing apparatus and method'20036,551,172'Polishing apparatus and polishing method'20036,503,361'Polishing method and polishing apparatus using the same'20036,390,903'Precise polishing apparatus and method'20026,332,835'Polishing apparatus with transfer arm for moving polished object without drying it'20016,165,050'Method of manufacturing semiconductor device using precision polishing apparatus with detecting means'20006,149,500'Precision polishing method using hermetically sealed chambers'20006,142,855'Polishing apparatus and polishing method'20006,137,575'Film thickness measuring method and apparatus'20006,093,081'Polishing method and polishing apparatus using the same'20006,038,068'Aberration correction system and astronomical telescope having the same'20006,012,966'Precision polishing apparatus with detecting means'20006,004,187'Method and apparatus for measuring film thickness and film thickness distribution during polishing'19995,904,611'Precision polishing apparatus'19995,087,121'Depth/height measuring device'19924,850,709'Fabri-perot spectroscopy method and apparatus utilizing the same'19894,787,749'Method and apparatus for measuring the thickness of a thin film using the spectral reflection factor of the film'19884,711,576'Wave front aberration measuring apparatus'19874,389,084'Observing apparatus'19834,322,130'Phase shifting mirror'19824,294,538'Image forming optical system'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2004Patents assigned to CANON KK (22)· patent assignee history
1981–1992Based in Yokohama, JP· patent location history
1999–2003Based in Miura, JP· patent location history
2000–2003Based in Haga-machi, JP· patent location history
2004Based in Tochigi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CANON KK | 22 | 1981–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Miura, JP | 10 | 1999–2003 |
| Yokohama, JP | 7 | 1981–1992 |
| Haga-machi, JP | 4 | 2000–2003 |
| Tochigi, JP | 1 | 2004 |