Inventor
PU-JU LIN
Inventor
TW
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01LSemiconductor devices25%
H05KPrinted circuits18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
C03CChemical composition of glasses, glazes or vitreous enamels2%
H10DInorganic electric semiconductor devices2%
B23PMetal-working not otherwise provided for1%
C23CCoating metallic material1%
C23FNon-mechanical removal of metallic material from surface1%
PatentTitleYear
12,568,810Anti-diffusion substrate structure and manufacturing method thereof202612,563,667Manufacturing method of circuit board structure202612,525,522Package structure and method for manufacturing the same202612,525,542Package structure and manufacturing method thereof202612,504,591Co-packaged structure for optics and electrics202512,438,060Chip package and method of manufacturing the same202512,406,368Visual analysis of sperm DNA fragmentation202512,369,250Circuit board structure and manufacturing method thereof202512,250,776Substrate structure and cutting method thereof202512,243,838Circuit substrate structure and manufacturing method thereof202512,218,017Glass carrier having protection structure and manufacturing method thereof202512,185,479Flexible circuit board and manufacturing method thereof202412,160,953Circuit board structure and manufacturing method thereof202412,062,742Package structure and manufacturing method of the same202411,991,824Circuit board structure and manufacturing method thereof202411,955,587Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device202411,943,877Circuit board structure and manufacturing method thereof202411,764,120Chip packaging structure and manufacturing method thereof202311,764,344Package structure and manufacturing method thereof202311,710,690Package structure and manufacturing method thereof202311,690,180Manufacturing method of carrier structure202311,682,612Package structure and manufacturing method thereof202311,665,832Circuit board structure and manufacturing method thereof202311,637,047Manufacturing method of chip package structure202311,516,910Circuit board structure and manufacturing method thereof202211,488,900Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same202211,476,234Chip package structure and manufacturing method thereof202211,462,452Chip package structure and manufacturing method thereof202211,460,255Vapor chamber device and manufacturing method thereof202211,424,216Electronic device bonding structure and fabrication method thereof202211,410,971Chip package structure202211,410,933Package structure and manufacturing method thereof202211,410,940Package structure with structure reinforcing element and manufacturing method thereof202211,366,381Mask structure and manufacturing method thereof202211,362,057Chip package structure and manufacturing method thereof202211,166,387Wiring board and manufacturing method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to UNIMICRON TECHNOLOGY CORP (35)· patent assignee history
2021–2026Based in TW· patent location history
2025Patents assigned to VITRUVIANMD PTE LTD (1)· patent assignee history
2025Based in CA· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIMICRON TECHNOLOGY CORP | 35 | 2021–2026 |
| VITRUVIANMD PTE LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 35 | 2021–2026 |
| CA | 1 | 2025 |