Inventor
Han Shin Youn
Inventor
Seoul, KR
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
B60LPropulsion of electrically-propelled vehicles11%
Y02TClimate change mitigation technologies related to transportation11%
B60WConjoint control of vehicle sub-units of different type or different function7%
G01RMeasuring electric variables7%
B60YIndexing scheme relating to aspects cross-cutting vehicle technology5%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%
H05KPrinted circuits5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
11,124,083Periodic supplementary charge method for battery of vehicle202111,110,801Fault diagnosis system of power converter for electric vehicle202110,756,551Charging system with sensor diagnosis function and method of diagnosing sensor applied to the same202010,618,426Method and system for controlling vehicle during charging202010,554,113Control system and method of low voltage DC-DC converter20209,866,130'DC-DC converter and control method thereof'20189,018,041'Package for semiconductor device including guide rings and manufacturing method of the same'20158,278,154'Method of fabricating a semiconductor device package including a heat radiation plate'20128,124,459'Bump chip carrier semiconductor package system'20127,952,199'Circuit board including solder ball land having hole and semiconductor package having the circuit board'20117,667,325'Circuit board including solder ball land having hole and semiconductor package having the circuit board'20107,504,736'Semiconductor packaging mold and method of manufacturing semiconductor package using the same'20097,436,049'Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package'20086,060,778'Ball grid array package'20004,960,812'Polyester resin compound'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000Patents assigned to HYUNDAI ELECTRONICS IND (1)· patent assignee history
2000–2021Based in Seoul, KR· patent location history
2008–2015Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2008–2012Based in Cheonan-si, KR· patent location history
2009–2011Based in Chungcheongnam-do, KR· patent location history
2015Based in Hwaseong-si, KR· patent location history
2018–2021Patents assigned to HYUNDAI MOTOR CO LTD (6)· patent assignee history
2018–2021Patents assigned to KIA MOTORS CORP (6)· patent assignee history
2018Patents assigned to KOREA ADVANCED INST SCI & TECH (1)· patent assignee history
2018Based in Daejeon, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HYUNDAI MOTOR CO LTD | 6 | 2018–2021 |
| KIA MOTORS CORP | 6 | 2018–2021 |
| SAMSUNG ELECTRONICS CO LTD | 6 | 2008–2015 |
| HYUNDAI ELECTRONICS IND | 1 | 2000 |
| KOREA ADVANCED INST SCI & TECH | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 6 | 2000–2021 |
| Chungcheongnam-do, KR | 3 | 2009–2011 |
| Cheonan-si, KR | 2 | 2008–2012 |
| Daejeon, KR | 1 | 2018 |
| Hwaseong-si, KR | 1 | 2015 |