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Inventor

Ming-Han Tsai

Inventor
Hsinchu, TW

Overview

44→
Patents
2010–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 44 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices15%
H01LSemiconductor devices11%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light9%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%
H04NPictorial communication, e.g. television5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
H10DInorganic electric semiconductor devices5%
G06FElectric digital data processing4%
H04WWireless communication networks4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,858,238Sensor package having a movable sensor202010,859,442Thermal pile sensing structure integrated with capacitor202010,852,192Wearable device with combined sensing capabilities202010,732,049Thermopile module202010,720,183Method and electronic device for generating multiple point of view video202010,704,651Low rotational speed gear module202010,670,465Wearable infrared temperature sensing device202010,589,982Sensor package having a movable sensor202010,418,458Semiconductor device and manufacturing method therefor201910,386,240Thermal pile sensing structure integrated with capacitor201910,384,928Manufacturing method of sensor package201910,358,339Micro-electro-mechanical device having low thermal expansion difference201910,283,612Semiconductor device and manufacturing method therefor201910,168,220Wearable infrared temperature sensing device201910,168,219Wearable device with combined sensing capabilities201910,161,802Thermal pile sensing structure integrated with capacitor201810,141,022Method and electronic device for generating multiple point of view video201810,113,912Thermopile module201810,018,573Dual-function wafer handling apparatus20189,944,513Micro-electro-mechanical device having low thermal expansion difference20189,945,726Thermal pile sensing structure integrated with capacitor20189,941,379Semiconductor device and manufacturing method therefor20189,929,210'Spin-orbit torque magnetic random access memory'20189,836,082Wearable electronic apparatus20179,783,409'Micro-electro-mechanical system device and micro-electro-mechanical system compensation structure'20179,677,985'Apparatus and method for inspecting filtering cartridge'20179,666,256'Spin-orbit torque magnetic random access memory and method of writing the same'20179,660,555'Micro-electro-mechanical system device with enhanced structural strength'20179,538,323'Wearable apparatus and controlling method thereof'20179,538,463'Apparatuses and methods for wireless fidelity (WiFi) network selection'20179,518,884'Micro-electro-mechanical device and method for making the same'20169,302,901'Micro-electro-mechanical system device with enhanced structural strength'20169,290,374'Micro-electro-mechanical system device having differential capacitors of corresponding sizes'20169,244,093'Micro-electro-mechanical sensing device and manufacturing method thereof'20169,070,699'Micromachined structures'20159,010,185'Three-dimensional micro-electro-mechanical-system sensor'20158,971,251'Method for performing wireless connection control, and associated apparatus and associated computer program product'20158,842,678'Mobile communication device and communicative transmission method'20148,772,885'MEMS sensing device and method for the same'20148,730,444'Pixel array structure'20148,519,491'MEMS sensing device and method for making same'20138,384,705'Display panel with shift register having reserve pull-up transistor'20138,105,498'Method for fabricating variable parallel plate capacitors'20127,849,742'Out-of-plane sensing device'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2020Patents assigned to PIXART IMAGING INC (26)· patent assignee history
2013–2017Patents assigned to TSAI MING-HAN (11)· patent assignee history
2013–2016Patents assigned to PIXART IMAGING INC ROC (4)· patent assignee history
2013–2020Based in Hsinchu, TW· patent location history
2013–2014Based in Taipei, TW· patent location history
2014–2020Patents assigned to HTC CORP (7)· patent assignee history
2014–2020Based in Taoyuan, TW· patent location history
2015–2017Patents assigned to SUN CHIH-MING (4)· patent assignee history
2017–2018Based in Taichung, TW· patent location history
2019–2020Based in Hsinchu County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PIXART IMAGING INC262010–2020
TSAI MING-HANself112013–2017
HTC CORP72014–2020
PIXART IMAGING INC ROC42013–2016
SUN CHIH-MING42015–2017
Locations
LocationPatentsSpan
Hsinchu, TW272013–2020
Taoyuan, TW72014–2020
Hsinchu County, TW32019–2020
Taichung, TW22017–2018
Taipei, TW22013–2014