LexDanaLexDanabeta
Inventor

Katsuhiko Horigome

Inventor
Shiraoka, JP

Overview

6→
Patents
2006–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C09JAdhesives14%
H01LSemiconductor devices14%
B23KSoldering or unsoldering7%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds7%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
C09DCoating compositions, e.g. paints, varnishes or lacquers7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10TTechnical subjects covered by former us classification7%
B24BMachines, devices, or processes for grinding or polishing4%
PatentTitleYear
10,879,104Adhesive tape for semiconductor processing and method for producing semiconductor device202010,825,790Protective film for semiconductors, semiconductor device, and composite sheet202010,460,973Adhesive tape for semiconductor processing and method for producing semiconductor device201910,086,594Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device20187,361,971'Semiconductor wafer protection structure and laminated protective sheet for use therein'20087,105,226'Pressure sensitive adhesive double coated sheet and method of use thereof'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2020Patents assigned to LINTEC CORP (6)· patent assignee history
2006–2008Based in Saitama, JP· patent location history
2018–2020Based in Tokyo, JP· patent location history
2019–2020Based in Shiraoka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LINTEC CORP62006–2020
Locations
LocationPatentsSpan
Shiraoka, JP22019–2020
Tokyo, JP22018–2020
Saitama, JP22006–2008