Inventor

AKIHIRO FUKATSU

Inventor

Overview

2021–2025

Patent span

Electricity

Primary field (CPC H)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices15%

C09KMaterials for miscellaneous applications, not provided for elsewhere10%

H05KPrinted circuits10%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

B82YSpecific uses or applications of nanostructures5%

C01GCompounds containing metals not covered by subclasses c01d or c01f5%

C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds5%

C25DProcesses for the electrolytic or electrophoretic production of coatings5%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact5%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (1)· patent assignee history

2021Patents assigned to NICHIA CORP (1)· patent assignee history

2021–2025Based in JP· patent location history

2024–2025Patents assigned to UACJ CORP (2)· patent assignee history

2024Patents assigned to DENSO CORP (1)· patent assignee history

2025Patents assigned to UNIV KYUSHU NAT UNIV CORP (1)· patent assignee history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
UACJ CORP	2	2024–2025
DENSO CORP	1	2024
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM	1	2021
NICHIA CORP	1	2021
UNIV KYUSHU NAT UNIV CORP	1	2025

Locations

Location	Patents	Span
JP	4	2021–2025