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Inventor

Roel Daamen

Inventor
Herkenbosch, NL

Overview

46→
Patents
2009–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 46 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices18%
G01NInvestigating or analysing materials by determining their chemical or physical properties17%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
H02NElectric machines not otherwise provided for3%
G01DMeasuring not specially adapted for a specific variable2%
H10NElectric solid-state devices not otherwise provided for2%
PatentTitleYear
11,002,696CMOS-compatible dew point sensor device and method of determining a dew point202110,475,716Sensor semiconductor device and method of producing a sensor semiconductor device201910,197,520Integrated circuit with sensor and method of manufacturing such an integrated circuit201910,192,842Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensors201910,171,007Method of manufacturing a device with a cavity20199,941,222Integrated circuit with sensor and method of manufacturing such an integrated circuit20189,921,228'Electronic lateral flow test arrangement and method'20189,891,183'Breach sensor'20189,884,715'Food package with integrated RFID-tag and sensor'20189,862,600'Chip structure'20189,865,647'Integrated circuit comprising a gas sensor'20189,859,818'Micro-device with a cavity'20189,818,905'Integrated circuit and manufacturing method'20179,766,195'Integrated circuit with sensor and method of manufacturing such an integrated circuit'20179,666,598'Semiconductor device with an integrated heat sink array'20179,632,049'Integrated circuit and manufacturing method therefor'20179,546,884'Sensor'20179,523,651'Integrated circuit comprising a gas sensor'20169,508,693'Semiconductor device with heat sinks'20169,453,807'Thermal conductivity gas sensor with amplification material'20169,419,043'Integrated circuit including a directional light sensor'20169,372,166'Integrated circuit comprising a thermal conductivity based gas sensor'20169,284,187'Integrated circuit with sensor and method of manufacturing such an integrated circuit'20169,281,239'Biocompatible electrodes and methods of manufacturing biocompatible electrodes'20169,263,500'Integrated circuit comprising a gas sensor'20169,188,540'Integrated circuit and manufacturing method'20159,177,852'Integrated circuits separated by through-wafer trench isolation'20159,070,695'Integrated circuit with sensor and method of manufacturing such an integrated circuit'20159,052,267'Integrated circuit and manufacturing method'20158,988,088'Liquid immersion sensor'20158,963,563'Capacitive sensor for detecting the presence of a substance'20158,925,371'Sensor'20158,906,729'Method of manufacturing a device with a cavity'20148,896,073'Integrated circuit and manufacturing method'20148,853,816'Integrated circuits separated by through-wafer trench isolation'20148,779,781'Capacitive sensor, integrated circuit, electronic device and method'20148,779,548'Integrated circuit including a porous material for retaining a liquid and manufacturing method thereof'20148,367,552'Method for fabrication of in-laid metal interconnects'20138,310,053'Method of manufacturing a device with a cavity'20128,273,653'Microscopic structure packaging method and device with packaged microscopic structure'20127,943,509'Method of making an interconnect structure'20117,791,059'Electric device with phase change resistor'20107,790,606'Method of forming an interconnect structure'20107,709,387'Polishing apparatus and two-step method of polishing a metal layer of an integrated circuit'20107,589,425'Method of manufacturing a semiconductor device having damascene structures with air gaps'20097,510,959'Method of manufacturing a semiconductor device having damascene structures with air gaps'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2010Based in Posterholt, NL· patent location history
2010–2018Patents assigned to NXP BV (24)· patent assignee history
2010–2021Based in Herkenbosch, NL· patent location history
2012–2019Patents assigned to DAAMEN ROEL (16)· patent assignee history
2013Based in Leuven, BE· patent location history
2014–2018Patents assigned to PONOMAREV YOURI VICTOROVITCH (8)· patent assignee history
2014Based in Limburg, BE· patent location history
2015–2019Patents assigned to MERZ MATTHIAS (8)· patent assignee history
2016–2019Patents assigned to AMS INT AG (9)· patent assignee history
2018Based in Eindhoven, NL· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NXP BV242010–2018
DAAMEN ROELself162012–2019
AMS INT AG92016–2019
MERZ MATTHIAS82015–2019
PONOMAREV YOURI VICTOROVITCH82014–2018
Locations
LocationPatentsSpan
Herkenbosch, NL392010–2021
Posterholt, NL32009–2010
Eindhoven, NL12018
Limburg, BE12014
Leuven, BE12013