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Inventor

Yurika Munekawa

Inventor
Iruma, JP

Overview

2→
Patents
2019–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering22%
C22CAlloys22%
H05KPrinted circuits22%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Y02PClimate change mitigation technologies in the production or processing of goods11%
PatentTitleYear
10,926,360Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device202110,456,872Lead-free solder alloy, electronic circuit substrate, and electronic device2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2021Patents assigned to TAMURA SEISAKUSHO KK (2)· patent assignee history
2019–2021Based in Iruma, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAMURA SEISAKUSHO KK22019–2021
Locations
LocationPatentsSpan
Iruma, JP22019–2021