Inventor
WENSEN HUNG
Inventor
TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
G06FElectric digital data processing2%
PatentTitleYear
12,550,729Heat spreading device and method202612,550,775Semiconductor package with stiffener structure and method of manufacturing the same202612,538,835Integrated chip package including a crack-resistant lid structure and methods of forming the same202612,387,988Method of manufacturing semiconductor package having lid structure202512,354,927Semiconductor device202512,272,612Semiconductor package module and manufacturing methods thereof202512,170,237Semiconductor structure and manufacturing method thereof202412,125,757Semiconductor package with stiffener structure and method forming the same202412,094,836Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof202412,074,154Package structure202412,021,006Package structure and method and equipment for forming the same202411,961,7793DIC packaging with hot spot thermal management features202411,929,293Semiconductor package with lid structure202411,810,833Package structure and method and equipment for forming the same202311,721,602Semiconductor package with stiffener structure202311,715,675Semiconductor device and manufacturing method thereof202311,594,469Semiconductor device and method of manufacture202311,587,845Semiconductor structure202311,302,600Semiconductor device and manufacturing method thereof202211,282,766Package structure202211,282,825Package structure202211,257,690None2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (22)· patent assignee history
2022–2026Based in TW· patent location history
2024Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD TSMC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 22 | 2022–2026 |
| TAIWAN SEMICONDUCTOR MFG COMPANY LTD TSMC | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 22 | 2022–2026 |