Inventor
Qianwen Chen
Inventor
Yorktown Heights, NY, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H05KPrinted circuits9%
Y02PClimate change mitigation technologies in the production or processing of goods6%
B24BMachines, devices, or processes for grinding or polishing5%
G01RMeasuring electric variables5%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy5%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
A61BDiagnosis4%
PatentTitleYear
10,833,296Thin film solid-state microbattery packaging202010,784,380Gate-all-around transistor based non-volatile memory devices202010,687,425Method of forming a plurality of electro-optical module assemblies2020D0886684T bar chain202010,670,656Integrated electro-optical module assembly202010,658,973Reconfigurable allocation of VNCAP inter-layer vias for co-tuning of L and C in LC tank202010,658,182Chip handling and electronic component integration202010,651,036Chip handling and electronic component integration202010,651,507Miniaturized electronics package with patterned thin film solid state battery202010,638,613Method of forming a plurality of electro-optical module assemblies202010,637,101Miniaturized electronics package with patterned thin film solid state battery202010,610,117Flexible silicon nanowire electrode202010,586,875Gate-all-around transistor based non-volatile memory devices202010,535,994Air gap metal tip electrostatic discharge protection202010,530,150Air gap metal tip electrostatic discharge protection202010,505,160Micro-battery using glass package201910,490,525High speed handling of ultra-small chips by selective laser bonding and debonding201910,407,791Selective solder plating201910,393,798Integrated electro-optical module assembly201910,395,929Chip handling and electronic component integration201910,380,284Heterogeneous miniaturization platform201910,361,140Wafer stacking for integrated circuit manufacturing201910,217,637Chip handling and electronic component integration20199,735,077'Heterogeneous miniaturization platform'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2020Patents assigned to IBM (23)· patent assignee history
2017–2020Based in Yorktown Heights, NY, US· patent location history
2019–2020Based in Ossining, NY, US· patent location history
2020Patents assigned to CHEN QIANWEN (1)· patent assignee history
2020Based in Guangzhou, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 23 | 2017–2020 |
| CHEN QIANWENself | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yorktown Heights, New York, US | 12 | 2017–2020 |
| Ossining, New York, US | 11 | 2019–2020 |
| Guangzhou, CN | 1 | 2020 |