Inventor

Ping-Yin Liu

Inventor

Yonghe City, TW

Overview

4→

Patents

2010–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices22%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%

B23KSoldering or unsoldering11%

B81BMicrostructural devices or systems, e.g. micromechanical devices11%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems11%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

PatentTitleYear

11,037,978Dual facing BSI image sensors with wafer level stacking2021 11,031,369Apparatus for bond wave propagation control2021 11,014,805Method of forming semiconductor package and semiconductor package2021 7,781,892'Interconnect structure and method of fabricating same'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history

2010Based in Tainan, TW· patent location history

2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history

2021Based in Yonghe City, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	3	2021
TAIWAN SEMICONDUCTOR MFG	1	2010

Locations

Location	Patents	Span
Yonghe City, TW	3	2021
Tainan, TW	1	2010