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Inventor

Shujie Cai

Inventor
Shenzhen, CN

Overview

3→
Patents
2020–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
PatentTitleYear
10,903,135Chip package structure and manufacturing method thereof202110,784,181Apparatus and manufacturing method202010,607,913Integrated circuit die and manufacture method thereof2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020–2021Patents assigned to HUAWEI TECH CO LTD (3)· patent assignee history
2020–2021Based in Shenzhen, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUAWEI TECH CO LTD32020–2021
Locations
LocationPatentsSpan
Shenzhen, CN32020–2021