Inventor
Chao-Ya Yang
Inventor
Taichung, TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H01LSemiconductor devices26%
H01QAntennas, i.e. radio aerials16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
10,587,037Electronic package structure202010,230,152Electronic package and fabrication method thereof20199,899,335'Method for fabricating package structure'20189,508,656'Package structure and method for fabricating the same'20169,502,377'Semiconductor package and fabrication method thereof'20168,963,299'Semiconductor package and fabrication method thereof'20158,912,959'Packaging structure and method of fabricating the same'20148,264,070'Package structure with ESD and EMI preventing functions'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2020Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (8)· patent assignee history
2012–2014Patents assigned to TSAI TSUNG-HSIEN (2)· patent assignee history
2012–2014Patents assigned to YANG CHAO-YA (2)· patent assignee history
2012Patents assigned to CHU HENG-CHENG (1)· patent assignee history
2012–2020Based in Taichung, TW· patent location history
2014Patents assigned to CHIU CHIH-HSIEN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO LTD | 8 | 2012–2020 |
| TSAI TSUNG-HSIEN | 2 | 2012–2014 |
| YANG CHAO-YAself | 2 | 2012–2014 |
| CHIU CHIH-HSIEN | 1 | 2014 |
| CHU HENG-CHENG | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 8 | 2012–2020 |