Inventor
Frank A. Shemansky, Jr.
Inventor
Phoenix, AZ, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Pprimary
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock50%
B81BMicrostructural devices or systems, e.g. micromechanical devices10%
G01CMeasuring distances, levels or bearings10%
H10DInorganic electric semiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
PatentTitleYear
6,465,281'Method of manufacturing a semiconductor wafer level package'20026,318,174'Sensor and method of use'20016,215,645'Differential capacitor structure'20016,105,428'Sensor and method of use'20005,824,565'Method of fabricating a sensor'19985,600,065'Angular velocity sensor'19975,550,090'Method for fabricating a monolithic semiconductor device with integrated surface micromachined structures'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2002Patents assigned to MOTOROLA INC (7)· patent assignee history
1996–2001Based in Phoenix, AZ, US· patent location history
2002Based in New Hope, PA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 7 | 1996–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 6 | 1996–2001 |
| New Hope, Pennsylvania, US | 1 | 2002 |