Inventor
HIROSHI OKADA
Inventor
JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering13%
H05KPrinted circuits13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
C22CAlloys8%
B22FWorking metallic powder5%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact5%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
G08GTraffic control systems5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
B60QArrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general3%
PatentTitleYear
12,501,582Vapor chamber202512,447,564Solder alloy, solder ball, and solder joint202512,078,423Vapor chamber with multilayer wick202411,872,656Core material, electronic component and method for forming bump electrode202411,823,507Recording device, recording method, and computer program202311,495,566Core material, electronic component and method for forming bump electrode202211,478,869Method for forming bump electrode substrate202211,358,514Mobile object and storage medium202211,344,976Solder material, solder paste, and solder joint202211,181,185Eccentric oscillating speed reducer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to DENSO CORP (1)· patent assignee history
2021–2025Based in JP· patent location history
2022–2025Patents assigned to SENJU METAL INDUSTRY CO (5)· patent assignee history
2022–2023Patents assigned to SONY CORP (2)· patent assignee history
2024–2025Patents assigned to FURUKAWA ELECTRIC CO LTD (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SENJU METAL INDUSTRY CO | 5 | 2022–2025 |
| FURUKAWA ELECTRIC CO LTD | 2 | 2024–2025 |
| SONY CORP | 2 | 2022–2023 |
| DENSO CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 10 | 2021–2025 |