Inventor
Kyung Wook Paik
Inventor
Clifton Park, NY, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification11%
C09JAdhesives6%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C08LCompositions of macromolecular compounds5%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
H01BCables3%
H01CResistors3%
H01PWaveguides3%
PatentTitleYear
9,376,541'Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package'20168,486,318'Fiber, fiber aggregate and adhesive having the same'20137,446,384'CMOS image sensor module with wafers'20087,381,468'Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same'20086,930,399'High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same'20056,878,435'High adhesion triple layered anisotropic conductive adhesive film'20056,514,560'Method for manufacturing conductive adhesive for high frequency flip chip package applications'20036,362,090'Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method'20026,238,597'Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate'20016,188,129'Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer'20016,124,149'Method of making stackable semiconductor chips to build a stacked chip module'20005,879,964'Method for fabricating chip size packages using lamination process'19995,849,623'Method of forming thin film resistors on organic surfaces'19985,776,275'Fabrication of compact magnetic circulator components in microwave packages using high density interconnections'19985,675,310'Thin film resistors on organic surfaces'19975,653,841'Fabrication of compact magnetic circulator components in microwave packages using high density interconnections'19975,418,002'Direct bonding of copper to aluminum nitride substrates'19955,352,629'Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules'19945,304,847'Direct thermocompression bonding for thin electronic power chips'19945,206,186'Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding'19935,184,206'Direct thermocompression bonding for thin electronic power chips'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–1998Patents assigned to GEN ELECTRIC (6)· patent assignee history
1993–1998Based in Clifton Park, NY, US· patent location history
1995Patents assigned to HARRIS CORP (1)· patent assignee history
1997–1998Patents assigned to MARTIN MARIETTA CORP (2)· patent assignee history
1999–2013Patents assigned to KOREA ADVANCED INST SCI & TECH (8)· patent assignee history
1999–2001Based in Taejeon, KR· patent location history
2000–2001Patents assigned to HYUNDAI ELECTRONICS IND (2)· patent assignee history
2000–2001Based in Daejon, KR· patent location history
2002–2005Based in Taejon, KR· patent location history
2005–2016Based in Daejeon, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KOREA ADVANCED INST SCI & TECH | 8 | 1999–2013 |
| GEN ELECTRIC | 6 | 1993–1998 |
| HYUNDAI ELECTRONICS IND | 2 | 2000–2001 |
| MARTIN MARIETTA CORP | 2 | 1997–1998 |
| HARRIS CORP | 1 | 1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Clifton Park, New York, US | 9 | 1993–1998 |
| Daejeon, KR | 5 | 2005–2016 |
| Taejon, KR | 3 | 2002–2005 |
| Taejeon, KR | 2 | 1999–2001 |
| Daejon, KR | 2 | 2000–2001 |