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Inventor

THERON L. LEWIS

Inventor
US

Overview

3→
Patents
2021–2022
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Pprimary
B23PMetal-working not otherwise provided for8%
F03GSpring, weight, inertia or like motors8%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact8%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%
G01BMeasuring length, thickness or similar linear dimensions8%
G02BOptical elements, systems or apparatus8%
G06FElectric digital data processing8%
H01LSemiconductor devices8%
H01RElectrically-conductive connections8%
H05KPrinted circuits8%
PatentTitleYear
11,268,809Detecting and correcting deficiencies in surface conditions for bonding applications202211,245,238Tool for shaping contact tab interconnects at a circuit card edge202211,175,100Heat sinks using memory shaping materials2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to IBM (3)· patent assignee history
2021–2022Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM32021–2022
Locations
LocationPatentsSpan
US32021–2022