Inventor
Ryuichi Kanamura
Inventor
Tokyo, JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H01LSemiconductor devices16%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation16%
H02GInstallation of electric cables or lines, or of combined optical and electric cables or lines5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
E04CStructural elements2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
10,840,290Semiconductor device, solid-state imaging device and electronic apparatus202010,535,700Semiconductor device, solid-state imaging device and electronic apparatus202010,475,845Semiconductor device, solid-state imaging device and electronic apparatus201910,128,301Semiconductor device, solid-state imaging device and electronic apparatus20189,917,131'Semiconductor device, solid-state imaging device and electronic apparatus'20189,570,499'Semiconductor device, solid-state imaging device and electronic apparatus'20179,431,450'Semiconductor device, solid-state imaging device and electronic apparatus'20167,642,655'Semiconductor device and method of manufacture thereof'20107,534,721'Semiconductor device manufacturing device'20097,319,271'Semiconductor device'20087,304,386'Semiconductor device having a multilayer wiring structure'20077,259,089'Semiconductor device manufacturing method that includes forming a wiring pattern with a mask layer that has a tapered shape'20077,242,096'Semiconductor device and method for manufacturing the same'20077,176,120'Method of manufacturing semiconductor device'20077,119,007'Production method of semiconductor device'20067,087,563'Resist stripping composition and method of producing semiconductor device using the same'20066,989,330'Semiconductor device and method of manufacture thereof'20066,946,385'Production method for semiconductor device'20056,856,018'Semiconductor device and method of manufacture thereof'20056,358,835'Method of manufacturing a semiconductor device'20025,723,362'Method of forming interconnection'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2020Patents assigned to SONY CORP (20)· patent assignee history
1998–2010Based in Tokyo, JP· patent location history
2006Patents assigned to EKC TECHNOLOGY K K (1)· patent assignee history
2016–2020Based in Kumamoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 20 | 1998–2020 |
| EKC TECHNOLOGY K K | 1 | 2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 14 | 1998–2010 |
| Kumamoto, JP | 7 | 2016–2020 |