Inventor
Mieko Hasegawa
Inventor
Kanagawa, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1058%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1042%
PatentTitleYear
8,329,584'Method of manufacturing semiconductor device'20127,955,980'Method of manufacturing semiconductor device'20117,687,918'Semiconductor device and method for manufacturing same'20107,629,656'Semiconductor device guard ring'20097,601,640'Method of manfacturing semiconductor device'20096,350,683'Method of forming a tungsten plug in a hole'20026,100,197'Method of fabricating a semiconductor device'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2002Patents assigned to NEC CORP (2)· patent assignee history
2000–2002Based in Tokyo, JP· patent location history
2009–2010Patents assigned to NEC ELECTRONICS CORP (3)· patent assignee history
2009–2012Based in Kanagawa, JP· patent location history
2011–2012Patents assigned to RENESAS ELECTRONICS CORP (2)· patent assignee history
2012Patents assigned to HASEGAWA MIEKO (1)· patent assignee history
2012Patents assigned to HIROI MASAYUKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC ELECTRONICS CORP | 3 | 2009–2010 |
| NEC CORP | 2 | 2000–2002 |
| RENESAS ELECTRONICS CORP | 2 | 2011–2012 |
| HASEGAWA MIEKOself | 1 | 2012 |
| HIROI MASAYUKI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 5 | 2009–2012 |
| Tokyo, JP | 2 | 2000–2002 |