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Inventor

Michael Barrow

Inventor
El Dorado Hills, CA, US

Overview

35→
Patents
1985–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 35 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H05KPrinted circuits23%
Y02PClimate change mitigation technologies in the production or processing of goods12%
B23KSoldering or unsoldering5%
Y10TTechnical subjects covered by former us classification4%
H01PWaveguides3%
B67CCleaning, filling with liquids or semiliquids, or emptying, of bottles, jars, cans, casks, barrels, or similar containers, not otherwise provided for1%
F16KValves1%
F25BRefrigeration machines, plants or systems1%
G01FMeasuring volume, volume flow, mass flow or liquid level1%
PatentTitleYear
9,684,293'Refrigerant relief valve monitoring system and method'20178,847,372'Exposed die overmolded flip chip package and fabrication method'20148,541,260'Exposed die overmolded flip chip package and fabrication method'20138,476,748'Exposed die overmolded flip chip package and fabrication method'20138,368,194'Exposed die overmolded flip chip package'20138,207,022'Exposed die overmolded flip chip package method'20128,109,765'Intelligent tutoring feedback'20127,898,093'Exposed die overmolded flip chip package and fabrication method'20117,543,377'Perimeter matrix ball grid array circuit package with a populated center'20096,747,362'Perimeter matrix ball grid array circuit package with a populated center'20046,521,845'Thermal spreading enhancements for motherboards using PBGAs'20036,498,390'Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing'20026,420,651'Integrated circuit package with bond wires at the corners of an integrated circuit'20026,297,078'Integrated circuit package with bond wires at the corners of an integrated circuit'20016,255,135'Quad flat pack integrated circuit package'20016,146,921'Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink'20006,118,182'Integrated circuit package with rectangular contact pads'20006,110,762'Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package'20005,978,224'Quad flat pack integrated circuit package'19995,949,651'Quad flat pack integrated circuit package'19995,936,848'Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias'19995,917,702'Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package'19995,898,219'Custom corner attach heat sink design for a plastic ball grid array integrated circuit package'19995,894,410'Perimeter matrix ball grid array circuit package with a populated center'19995,889,655'Integrated circuit package substrate with stepped solder mask openings'19995,880,529'Silicon metal-pillar conductors under stagger bond pads'19995,875,102'Eclipse via in pad structure'19995,867,367'Quad flat pack integrated circuit package'19995,812,379'Small diameter ball grid array pad size for improved motherboard routing'19985,801,450'Variable pitch stagger die for optimal density'19985,796,589'Ball grid array integrated circuit package that has vias located within the solder pads of a package'19985,706,178'Ball grid array integrated circuit package that has vias located within the solder pads of a package'19984,560,962'Multilayered printed circuit board with controlled 100 ohm impedance'19854,553,111'Printed circuit board maximizing areas for component utilization'19854,507,931'Bottling plant cooling systems'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1985Patents assigned to BURROUGHS CORP (2)· patent assignee history
1985Based in Laguna Hills, CA, US· patent location history
1998–2009Patents assigned to INTEL CORP (24)· patent assignee history
1998–2009Based in El Dorado Hills, CA, US· patent location history
2011–2014Patents assigned to AMKOR TECHNOLOGY INC (6)· patent assignee history
2011–2014Based in Chandler, AZ, US· patent location history
2012–2013Patents assigned to BARROW MICHAEL (3)· patent assignee history
2012–2013Patents assigned to DARVEAUX ROBERT FRANCIS (2)· patent assignee history
2012Based in Wayland, MA, US· patent location history
2017Based in Sharpsburg, GA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP241998–2009
AMKOR TECHNOLOGY INC62011–2014
BARROW MICHAELself32012–2013
BURROUGHS CORP21985
DARVEAUX ROBERT FRANCIS22012–2013
Locations
LocationPatentsSpan
El Dorado Hills, California, US241998–2009
Chandler, AZ, US62011–2014
Laguna Hills, California, US21985
Sharpsburg, Georgia, US12017
Wayland, Massachusetts, US12012