Inventor
Katsuyu Wakabayashi
Inventor
Settsu, JP
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds19%
C08LCompositions of macromolecular compounds19%
C09KMaterials for miscellaneous applications, not provided for elsewhere16%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients15%
C09JAdhesives13%
C09DCoating compositions, e.g. paints, varnishes or lacquers11%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
A61LMethods or apparatus for sterilising materials or objects in general1%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%
C07DHeterocyclic compounds1%
PatentTitleYear
10,907,012Polycarbonate diol and producing method thereof, and polyurethane and active energy ray-curable polymer composition both formed using same202110,077,375Curable composition20189,969,843Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same2018RE046688'Curable composition'20189,803,052'Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same'20179,505,879'Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same'20169,249,262'Curable organic polymer and method for production thereof, and curable composition containing the same'20169,051,501'Curable composition and catalyst composition'20158,962,716'Curable composition'20158,901,255'Curable composition'20148,815,985'Curable composition'20148,586,688'Curable composition and method for improving recovery properties and creep properties'20138,124,690'Moisture curable polymer having SiF group, and curable composition containing the same'20128,030,427'Curable composition'20118,013,080'Curable composition'20118,003,744'Curing composition with improved heat resistance'20117,973,108'Curable composition'20117,910,681'Curable composition having improved adhesion'20117,910,682'Curable composition and methods for improving recovery properties and creep properties'20117,893,170'Curable composition having improved curability and adhesion'20117,807,756'Curable composition'20107,772,332'Curable composition'20107,652,119'Curable composition'20107,625,990'Curable composition'20097,605,220'Curing composition'20097,550,547'Curable composition'20097,446,158'Curable composition'20087,351,782'One-part curable composition'20087,115,695'Curable composition'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2018Patents assigned to KANEKA CORP (28)· patent assignee history
2008–2016Based in Settsu, JP· patent location history
2008–2011Based in Nishinomiya, JP· patent location history
2011–2018Based in Takasago, JP· patent location history
2012–2016Patents assigned to WAKABAYASHI KATSUYU (6)· patent assignee history
2012–2015Patents assigned to SASAKI TAISUKE (2)· patent assignee history
2013–2014Patents assigned to OKAMOTO TOSHIHIKO (2)· patent assignee history
2014–2015Patents assigned to OUCHI KATSUYA (2)· patent assignee history
2018Based in Westerlo-Oevel, BE· patent location history
2021Based in Yokohama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KANEKA CORP | 28 | 2006–2018 |
| WAKABAYASHI KATSUYUself | 6 | 2012–2016 |
| OKAMOTO TOSHIHIKO | 2 | 2013–2014 |
| OUCHI KATSUYA | 2 | 2014–2015 |
| SASAKI TAISUKE | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Settsu, JP | 15 | 2008–2016 |
| Takasago, JP | 6 | 2011–2018 |
| Nishinomiya, JP | 3 | 2008–2011 |
| Yokohama, JP | 1 | 2021 |
| Westerlo-Oevel, BE | 1 | 2018 |