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Inventor

Steven L. Hanakovic

Inventor
Vestal, NY, US

Overview

4→
Patents
1994–1997
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits27%
H01RElectrically-conductive connections20%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests20%
Y10TTechnical subjects covered by former us classification20%
B23KSoldering or unsoldering7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
PatentTitleYear
5,620,782'Method of fabricating a flex laminate package'19975,509,196'Method of fabricating a flex laminate package'19965,384,690'Flex laminate package for a parallel processor'19955,316,788'Applying solder to high density substrates'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–1997Patents assigned to IBM (4)· patent assignee history
1994–1997Based in Vestal, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM41994–1997
Locations
LocationPatentsSpan
Vestal, New York, US41994–1997