Inventor
HAYATO SAWAMOTO
Inventor
JP
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Fprimary
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds17%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
H01LSemiconductor devices17%
H05KPrinted circuits17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
PatentTitleYear
12,498,636Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board202512,103,999Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to RESONAC CORP (2)· patent assignee history
2024–2025Patents assigned to SHOWA DENKO MATERIALS CO LTD (2)· patent assignee history
2024–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RESONAC CORP | 2 | 2024–2025 |
| SHOWA DENKO MATERIALS CO LTD | 2 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 2 | 2024–2025 |