Inventor
SHENG-FENG WENG
Inventor
TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
B29CShaping or joining of plastics8%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2%
PatentTitleYear
12,593,732Semiconductor device and manufacturing method thereof202612,568,854Semiconductor packages having semiconductor blocks surrounding semiconductor device202612,512,384Semiconductor package with electrically conductive structure and manufacturing method thereof202512,512,419Method of fabricating memory device and package structure202512,358,194Molded semiconductor device and manufacturing method of molded semiconductor device202512,354,997Package structure and manufacturing method thereof202512,354,929Package structure and manufacturing method thereof202512,334,424Package structure and manufacturing method thereof202512,230,549Three-dimensional integrated circuit structures and methods of forming the same202512,218,082Package structure202512,011,859Molding apparatus and manufacturing method of molded semiconductor device202411,955,460Advanced info POP and method of forming thereof202411,855,006Memory device, package structure and fabricating method thereof202311,731,327Molding apparatus and manufacturing method of molded semiconductor device202311,446,851Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device202211,309,226Three-dimensional integrated circuit structures and methods of forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (16)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 16 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 16 | 2022–2026 |