Inventor
Kunmo Chu
Inventor
Seoul, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01BCables10%
H01RElectrically-conductive connections10%
H05KPrinted circuits10%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C08LCompositions of macromolecular compounds5%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
H10KOrganic electric solid-state devices5%
PatentTitleYear
10,392,518Paste material, wiring member formed from the paste material, and electronic device including the wiring member201910,249,604Semiconductor device and method of manufacturing the same201910,211,194Semiconductor device and method of manufacturing the same20199,831,211Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2017Patents assigned to YONSEI UNIV WONJU INDUSTRY-ACADEMIC COOPERATION FOUNDATION (1)· patent assignee history
2017–2019Based in Seoul, KR· patent location history
2019Patents assigned to FOUNDATION SOONGSIL UNIV INDUSTRY COOPERATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 3 | 2017–2019 |
| FOUNDATION SOONGSIL UNIV INDUSTRY COOPERATION | 1 | 2019 |
| YONSEI UNIV WONJU INDUSTRY-ACADEMIC COOPERATION FOUNDATION | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 4 | 2017–2019 |