Inventor

Kazuhiko Kurafuchi

Inventor

Tokyo, JP

Overview

16→

Patents

1995–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%

H01LSemiconductor devices13%

H05KPrinted circuits10%

B22FWorking metallic powder7%

C08LCompositions of macromolecular compounds6%

Y10TTechnical subjects covered by former us classification6%

B23KSoldering or unsoldering4%

C08JWorking-up4%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%

PatentTitleYear

11,040,416Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device2021 10,930,612Copper paste for pressureless bonding, bonded body and semiconductor device2021 10,756,008Organic interposer and method for manufacturing organic interposer2020 10,748,865Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device2020 10,575,402Resin composition, wiring layer laminate for semiconductor, and semiconductor device2020 10,566,304Assembly and semiconductor device2020 10,388,608Semiconductor device and method for manufacturing same2019 10,363,608Copper paste for joining, method for producing joined body, and method for producing semiconductor device2019 10,034,384Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition2018 9,661,763'Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition'2017 9,075,307'Photosensitive resin composition for protective film of printed wiring board for semiconductor package'2015 6,774,501'Resin-sealed semiconductor device, and die bonding material and sealing material for use therein'2004 6,256,875'Method for manufacturing semiconductor device'2001 6,005,289'Package for semiconductor device laminated printed circuit boards'1999 5,672,965'Evaluation board for evaluating electrical characteristics of an IC package'1997 5,410,182'High density semiconductor device having inclined chip mounting'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2001Patents assigned to MITSUBISHI ELECTRIC CORP (4)· patent assignee history

1995Based in Itami, JP· patent location history

1997Based in Kikuchi-gun, JP· patent location history

1999–2001Patents assigned to RYODEN SEMICONDUCTOR SYST ENG (2)· patent assignee history

1999–2021Based in Tokyo, JP· patent location history

2004–2021Patents assigned to HITACHI CHEMICAL CO LTD (12)· patent assignee history

2004–2018Based in Tsukuba, JP· patent location history

2015Patents assigned to FUSE YOSHIAKI (1)· patent assignee history

2021Patents assigned to SHOWA DENKO MATERIALS CO LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI CHEMICAL CO LTD	12	2004–2021
MITSUBISHI ELECTRIC CORP	4	1995–2001
RYODEN SEMICONDUCTOR SYST ENG	2	1999–2001
SHOWA DENKO MATERIALS CO LTD	2	2021
FUSE YOSHIAKI	1	2015

Locations

Location	Patents	Span
Tokyo, JP	10	1999–2021
Tsukuba, JP	4	2004–2018
Kikuchi-gun, JP	1	1997
Itami, JP	1	1995