Inventor

Gu-Sung Kim

Inventor

Seongnam-si, KR

Overview

37→

Patents

1992–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 37 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%

Y02PClimate change mitigation technologies in the production or processing of goods9%

Y10TTechnical subjects covered by former us classification9%

H05KPrinted circuits8%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

H04NPictorial communication, e.g. television4%

A47GHousehold or table equipment3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

B03DFlotation1%

PatentTitleYear

10,930,887Flexible organic light emitting display device having a dam in a folding region2021 8,821,826'Method for regenerating silicon from silicon waste and silicon manufactured using the same'2014 8,368,231'Chipstack package and manufacturing method thereof'2013 8,278,766'Wafer level stack structure for system-in-package and method thereof'2012 7,977,156'Chipstack package and manufacturing method thereof'2011 7,824,959'Wafer level stack structure for system-in-package and method thereof'2010 7,786,594'Wafer level stack structure for system-in-package and method thereof'2010 7,550,317'Method for manufacture of wafer level package with air pads'2009 7,537,959'Chip stack package and manufacturing method thereof'2009 7,534,656'Image sensor device and method of manufacturing the same'2009 7,531,890'Multi-chip package (MCP) with a conductive bar and method for manufacturing the same'2009 7,521,657'Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same'2009 7,375,426'Semiconductor package'2008 7,371,614'Image sensor device and methods thereof'2008 7,307,340'Wafer-level electronic modules with integral connector contacts'2007 7,300,864'Method for forming solder bump structure'2007 7,276,799'Chip stack package and manufacturing method thereof'2007 7,262,475'Image sensor device and method of manufacturing same'2007 7,224,055'Center pad type IC chip with jumpers, method of processing the same and multi chip package'2007 7,215,033'Wafer level stack structure for system-in-package and method thereof'2007 7,196,000'Method for manufacturing a wafer level chip scale package'2007 7,141,885'Wafer level package with air pads and manufacturing method thereof'2006 6,908,785'Multi-chip package (MCP) with a conductive bar and method for manufacturing the same'2005 6,836,018'Wafer level package and method for manufacturing the same'2004 6,607,938'Wafer level stack chip package and method for manufacturing same'2003 6,586,275'Wafer level package and method for manufacturing the same'2003 6,518,675'Wafer level package and method for manufacturing the same'2003 5,621,242'Semiconductor package having support film formed on inner leads'1997 5,568,057'Method for performing a burn-in test'1996 5,552,635'High thermal emissive semiconductor device package'1996 5,518,957'Method for making a thin profile semiconductor package'1996 5,504,373'Semiconductor memory module'1996 5,407,864'Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip'1995 5,356,838'Manufacturing method of a semiconductor device'1994 5,199,164'Method of manufacturing semiconductor package'1993 5,186,381'Semiconductor chip bonding process'1993 5,157,588'Semiconductor package and manufacture thereof'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–2013Patents assigned to SAMSUNG ELECTRONICS CO LTD (35)· patent assignee history

1992–1996Based in Seoul, KR· patent location history

1994–1997Based in Suwon-si, KR· patent location history

1996–2009Based in Kyungki-do, KR· patent location history

2007–2013Based in Seongnam-si, KR· patent location history

2007–2021Based in Gyeonggi-do, KR· patent location history

2012–2013Patents assigned to KIM GU-SUNG (2)· patent assignee history

2012–2013Patents assigned to LEE KANG-WOOK (2)· patent assignee history

2013Patents assigned to BAEK SEUNG-DUK (1)· patent assignee history

2013Patents assigned to CHUNG JAE-SIK (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SAMSUNG ELECTRONICS CO LTD	35	1992–2013
KIM GU-SUNGself	2	2012–2013
LEE KANG-WOOK	2	2012–2013
BAEK SEUNG-DUK	1	2013
CHUNG JAE-SIK	1	2013

Locations

Location	Patents	Span
Seongnam-si, KR	13	2007–2013
Kyungki-do, KR	9	1996–2009
Suwon-si, KR	5	1994–1997
Gyeonggi-do, KR	4	2007–2021
Seoul, KR	4	1992–1996