Inventor
Klaus Höhn
Inventor
Taufkirchen, DE
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
C09KMaterials for miscellaneous applications, not provided for elsewhere16%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications15%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
C08LCompositions of macromolecular compounds3%
H01LSemiconductor devices3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium1%
PatentTitleYear
10,597,512Optoelectronic device with a mixture having a silicone and a fluoro-organic additive20209,310,538'Composition for producing a filter material for radiation, method for producing a composition for a filter material, material for filtering radiation, and an optoelectronic device comprising the material'20169,196,800'Light-radiating semiconductor component with a luminescence conversion element'20158,723,198'Wavelength-converting converter material, light-emitting optical component, and method for the production thereof'20148,071,996'Wavelength-converting casting composition and light-emitting semiconductor component'20117,709,852'Wavelength-converting casting composition and light-emitting semiconductor component'20107,629,621'Light-radiating semiconductor component with a luminescence conversion element'20097,534,634'Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source'20097,455,461'Optoelectronic component and method for the production thereof'20087,436,002'Surface-mountable radiation-emitting component'20087,345,317'Light-radiating semiconductor component with a luminescene conversion element'20087,288,606'Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities'20077,276,736'Wavelength-converting casting composition and white light-emitting semiconductor component'20077,235,189'Method of producing a wavelength-converting casting composition'20077,151,283'Light-radiating semiconductor component with a luminescence conversion element'20067,126,162'Light-radiating semiconductor component with a luminescence conversion element'20067,098,588'Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source'20067,078,732'Light-radiating semiconductor component with a luminescence conversion element'20067,009,008'Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities'20066,888,174'Opto-electronic semiconductor component'20056,812,500'Light-radiating semiconductor component with a luminescence conversion element'20046,613,247'Wavelength-converting casting composition and white light-emitting semiconductor component'20036,592,780'Wavelength-converting casting composition and white light-emitting semiconductor component'20036,576,930'Light-radiating semiconductor component with a luminescence conversion element'20036,297,344'Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range'20016,277,301'Method of producing a wavelength-converting casting composition'20016,248,854'Modified epoxysiloxane condensate, process for producing the same and its use as low-stress casting resins in the electronic and electrotechnical industry'20016,245,259'Wavelength-converting casting composition and light-emitting semiconductor component'20016,066,861'Wavelength-converting casting composition and its use'20005,883,214'Process for the preparation of epoxysilanes'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2001Patents assigned to SIEMENS AG (4)· patent assignee history
1999–2015Based in Taufkirchen, DE· patent location history
2001–2020Patents assigned to OSRAM OPTO SEMICONDUCTORS GMBH (10)· patent assignee history
2006–2015Patents assigned to OSRAM GMBH (15)· patent assignee history
2006–2020Based in Forchheim, DE· patent location history
2011–2015Patents assigned to SCHLOTTER PETER (2)· patent assignee history
2014–2015Patents assigned to HÖHN KLAUS (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| OSRAM GMBH | 15 | 2006–2015 |
| OSRAM OPTO SEMICONDUCTORS GMBH | 10 | 2001–2020 |
| SIEMENS AG | 4 | 1999–2001 |
| HÖHN KLAUSself | 2 | 2014–2015 |
| SCHLOTTER PETER | 2 | 2011–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taufkirchen, DE | 25 | 1999–2015 |
| Forchheim, DE | 5 | 2006–2020 |