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Inventor

Hisao Aota

Inventor
Higashiosaka, JP

Overview

3→
Patents
2014–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics50%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts33%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
10,773,426Resin molding mold202010,124,514Resin molding mold20188,794,951'Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to AOTA HISAO (1)· patent assignee history
2014Patents assigned to OMIYA YUMIKO (1)· patent assignee history
2014Patents assigned to SAKAI MASAYUKI (1)· patent assignee history
2014Patents assigned to SAMEJIMA MITSUAKI (1)· patent assignee history
2014Based in Nara, JP· patent location history
2018–2020Patents assigned to TANAZAWA HAKKOSHA KK (2)· patent assignee history
2018–2020Based in Higashiosaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TANAZAWA HAKKOSHA KK22018–2020
AOTA HISAOself12014
OMIYA YUMIKO12014
SAKAI MASAYUKI12014
SAMEJIMA MITSUAKI12014
Locations
LocationPatentsSpan
Higashiosaka, JP22018–2020
Nara, JP12014