Inventor
Stephen C. Schultz
Inventor
Gilbert, AZ, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing65%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
PatentTitleYear
7,402,098'Carrier head for workpiece planarization/polishing'20087,335,092'Carrier head for workpiece planarization/polishing'20087,140,956'Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece'20067,040,957'Platen and manifold for polishing workpieces'20067,025,664'Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece'20067,014,541'Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece'20066,932,671'Method for controlling a chemical mechanical polishing (CMP) operation'20056,878,039'Polishing pad window for a chemical-mechanical polishing tool'20056,790,123'Method for processing a work piece in a multi-zonal processing apparatus'20046,758,939'Laminated wear ring'20046,659,850'Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece'20036,612,903'Workpiece carrier with adjustable pressure zones and barriers'20036,599,175'Apparatus for distributing a fluid through a polishing pad'20036,568,991'Method and apparatus for sensing a wafer in a carrier'20036,540,592'Carrier head with reduced moment wear ring'20036,500,055'Oscillating orbital polisher and method'20026,447,379'Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor'20026,390,905'Workpiece carrier with adjustable pressure zones and barriers'20026,336,853'Carrier having pistons for distributing a pressing force on the back surface of a workpiece'20026,184,139'Oscillating orbital polisher and method'20015,643,061'Pneumatic polishing head for CMP apparatus'19975,456,627'Conditioner for a polishing pad and method therefor'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995Patents assigned to WESTECH SYSTEMS INC (1)· patent assignee history
1995–2008Based in Gilbert, AZ, US· patent location history
1997Patents assigned to INTEGRATED PROCESS EQUIPMENT C (1)· patent assignee history
2001–2006Patents assigned to SPEEDFAM IPEC CORP (15)· patent assignee history
2003Patents assigned to SPEEDFAM IPECA CORP (1)· patent assignee history
2005–2008Patents assigned to NOVELLUS SYSTEMS INC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SPEEDFAM IPEC CORP | 15 | 2001–2006 |
| NOVELLUS SYSTEMS INC | 4 | 2005–2008 |
| INTEGRATED PROCESS EQUIPMENT C | 1 | 1997 |
| SPEEDFAM IPECA CORP | 1 | 2003 |
| WESTECH SYSTEMS INC | 1 | 1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gilbert, AZ, US | 22 | 1995–2008 |